Fabrication and shear strength analysis of Sn-3.5Ag/Cu-filled TSV for 3D microelectronic packaging
Crossref DOI link: https://doi.org/10.1007/s13391-016-6144-8
Published Online: 2016-09-09
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Sharma, Ashutosh
Jung, Do-Hyun
Roh, Myong-Hoon
Jung, Jae Pil
License valid from 2016-09-09