On the potential of tungsten as next-generation semiconductor interconnects
Crossref DOI link: https://doi.org/10.1007/s13391-017-1610-5
Published Online: 2017-09-10
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Choi, Dooho
Barmak, Katayun
License valid from 2017-09-01