Crossmark

Microstructure and mechanical behavior of low-melting point Bi-Sn-In solder joints

Crossref DOI link: https://doi.org/10.1007/s13391-017-1614-1

Published Online: 2017-09-10

Published Print: 2017-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Nguyen, Van Luong

Kim, Sang Hoon

Jeong, Jae Won

Lim, Tae-Soo

Yang, Dong-Yeol

Kim, Ki Bong

Kim, Young Ja

Lee, Jun Hong

Kim, Yong-Jin

Yang, Sangsun
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License valid from 2017-09-01