Document is current

Any future updates will be listed below

Investigation of microstructural evolution and electrical properties for Ni-Sn transient liquid-phase sintering bonding

Crossref DOI link: https://doi.org/10.1007/s13391-017-6317-0

Published Online: 2017-11-10

Published Print: 2017-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark