Effect of Sn grain orientation and strain distribution in 20-μm-diameter microbumps on crack formation under thermal cycling tests
Crossref DOI link: https://doi.org/10.1007/s13391-017-7041-5
Published Online: 2017-06-24
Published Print: 2017-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chu, Yi-Cheng
Chen, Chih
Kao, Nicholas
Jiang, Don Son
License valid from 2017-06-24