Ni Barrier Symmetry Effect on Electromigration Failure Mechanism of Cu/Sn–Ag Microbump
Crossref DOI link: https://doi.org/10.1007/s13391-018-00108-5
Published Online: 2018-12-12
Published Print: 2019-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Gyu-Tae
Lee, Byeong-Rok
Son, Kirak
Park, Young-Bae
Text and Data Mining valid from 2018-12-12
Article History
Received: 20 September 2018
Accepted: 20 November 2018
First Online: 12 December 2018