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Adhesive Mechanism of Al2O3/Cu Composite Film via Aerosol Deposition Process for Application of Film Resistor

Crossref DOI link: https://doi.org/10.1007/s13391-018-00111-w

Published Online: 2019-01-11

Published Print: 2019-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Cho, Myung-Yeon

Lee, Dong-Won

Ko, Pil-Ju

Koo, Sang-Mo

Kim, Jaesik

Choi, Youn-Kyu

Oh, Jong-Min
Funding

Funding for this research was provided by:

Ministry of Science, ICT and Future Planning (2018R1D1A1B07045295)

Korea Institute of Energy Technology Evaluation and Planning (20174010201290)
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Article History

Received: 7 October 2018

Accepted: 29 November 2018

First Online: 11 January 2019