Characterization of Copper Complex Paste: Manufacture of Thin Cu-Seed Films on Alumina Substrates
Crossref DOI link: https://doi.org/10.1007/s13391-018-00117-4
Published Online: 2019-01-02
Published Print: 2019-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Chang Hyun
Lee, Jong-Hyun
Funding for this research was provided by:
Research Program funded by the SeoulTech (2018-0497)
Text and Data Mining valid from 2019-01-02
Article History
Received: 7 November 2018
Accepted: 21 December 2018
First Online: 2 January 2019