Characterization of Atomic-Layer-Deposited (ALD) Al2O3-Passivated Sub-50-μm-thick Kerf-less Si Wafers by Controlled Spalling
Crossref DOI link: https://doi.org/10.1007/s13391-018-0039-9
Published Online: 2018-03-06
Published Print: 2018-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Yong Hwan
Cha, Hamchorom
Choi, Sunho
Chang, Hyo Sik
Jang, Boyun
Oh, Jihun
Text and Data Mining valid from 2018-03-06
Article History
Received: 30 September 2017
Accepted: 28 December 2017
First Online: 6 March 2018