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Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue

Crossref DOI link: https://doi.org/10.1007/s13391-018-0043-0

Published Online: 2018-03-06

Published Print: 2018-07

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Yi, Seol-Min

Choi, In-Suk

Kim, Byoung-Joon https://orcid.org/0000-0002-3914-1842
Joo, Young-Chang
Funding

Funding for this research was provided by:

National Research Foundation of Korea (2017R1C1B5017889)

Ministry of Trade, Industry and Energy (Development of Interconnection System)

Ministry of Trade, Industry and Energy (Process for Flexible Three Dimensional Heterogeneous Devices)
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Article History

Received: 14 December 2017

Accepted: 9 January 2018

First Online: 6 March 2018