Size Effect on the Electromigration Characteristics of Flip Chip Pb-free Solder Bumps
Crossref DOI link: https://doi.org/10.1007/s13391-022-00356-6
Published Online: 2022-07-04
Published Print: 2022-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Gahui
Son, Kirak
Lee, Jang-Hee
Joo, Young-Chang
Park, Young-Bae
Text and Data Mining valid from 2022-07-04
Version of Record valid from 2022-07-04
Article History
Received: 8 February 2022
Accepted: 2 June 2022
First Online: 4 July 2022
Declarations
:
: The authors declare that they have no conflict of interest.