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Effects of Dielectric Curing Temperature on the Interfacial Reliability of Cu/Ti/PBO for FOWLP Applications

Published Online: 2024-02-19

Published Print: 2024-07

Authors

Kim, Gahui

Son, Kirak

Kim, Young-Cheon

Park, Young-Bae
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Text and Data Mining valid from 2024-02-19

Version of Record valid from 2024-02-19
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Article History

Received: 24 October 2023

Accepted: 17 January 2024

First Online: 19 February 2024

Declarations

:

: The authors declare that they have no conflict of interest.

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