Enhanced Magnetic Permeability Through Improved Packing Density for Thin-Film Type Power Inductors for High-Frequency Applications
Crossref DOI link: https://doi.org/10.1007/s13391-024-00517-9
Published Online: 2024-08-20
Published Print: 2024-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
An, Sung Yong
Kim, Boum Seock https://orcid.org/0009-0005-5845-2143
Text and Data Mining valid from 2024-08-20
Version of Record valid from 2024-08-20
Article History
Received: 25 April 2024
Accepted: 11 August 2024
First Online: 20 August 2024
Declarations
:
: The author declare that they have no conflict of interest.