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Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints

Published Online: 2024-11-30

Published Print: 2025-01

Authors

Yao, Yifan

Lu, Zhunan

An, Yuxuan

Tu, K. N.

Liu, Yingxia https://orcid.org/0000-0003-0482-3904
Funding

Funding for this research was provided by:

City University of Hong Kong
License Information

Text and Data Mining valid from 2024-11-30

Version of Record valid from 2024-11-30
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Article History

Received: 27 September 2024

Accepted: 18 November 2024

First Online: 30 November 2024

Declarations

:

: The authors report there are no competing interests to declare.

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