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Effect of Ar/N2 Two-Step Plasma Treatments on the Interfacial Characteristics of Low-Temperature Cu-Cu Direct Bonding

Published Online: 2025-03-17

Authors

Kim, Gahui

Choi, Seonghun

Kwon, Yongbeom

Kim, Sarah Eunkyung

Lee, Hoo-Jeong

Park, Young-Bae
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Text and Data Mining valid from 2025-03-17

Version of Record valid from 2025-03-17
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Article History

Received: 22 November 2024

Accepted: 3 March 2025

First Online: 17 March 2025

Declarations

:

: The authors declare that they have no conflict of interest.

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