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Effects of the Dielectric Curing Temperature on the Interfacial Adhesion Characteristics of Photosensitive Polyimide/Cu RDL Structures for Fan-Out Packages

Crossref DOI link: https://doi.org/10.1007/s13391-026-00650-7

Published Online: 2026-05-13

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Kim, Doheon

Kim, Gahui

Jeong, Daeyoon

Park, Young-Bae
Funding

Funding for this research was provided by:

National Research Foundation of Korea (RS-2023-00239657)

National Research Foundation of Korea (RS-2024-00423772)
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Text and Data Mining valid from 2026-05-13

Version of Record valid from 2026-05-13
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Article History

Received: 12 December 2025

Accepted: 14 April 2026

First Online: 13 May 2026

Declarations

:

: The authors declare that they have no conflict of interest.

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