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Intermetallic growth kinetics of 2N gold wire ball bonds on aluminium bond pads annealed at 175 °C

Crossref DOI link: https://doi.org/10.1007/s13404-016-0184-6

Published Online: 2016-10-03

Published Print: 2016-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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