Microstructural Evolutions During the ECMAP Process Using the Die with Optimum Geometrical Parameters
Crossref DOI link: https://doi.org/10.1007/s13632-020-00664-z
Published Online: 2020-07-13
Published Print: 2020-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Keshtiban, P. M.
Text and Data Mining valid from 2020-07-13
Version of Record valid from 2020-07-13
Article History
Received: 14 May 2020
Revised: 27 June 2020
Accepted: 30 June 2020
First Online: 13 July 2020