Developing a parametric carbon footprinting tool for the semiconductor industry
Crossref DOI link: https://doi.org/10.1007/s13762-015-0869-z
Published Online: 2015-08-04
Published Print: 2016-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Huang, C.-Y.
Hu, A. H.
Yin, J.
Wang, H.-C.
Text and Data Mining valid from 2015-08-04