A Study on the Effect of Ageing and Intermetallic Compound Growth on the Shear Strength of Surface Mount Technology Solder Joints
Crossref DOI link: https://doi.org/10.1007/s40033-014-0063-3
Published Online: 2015-01-24
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nath, Jyotishman
Mallik, Sabuj
Borah, Anil
Text and Data Mining valid from 2015-01-24