Crossmark

Low-melting metal thermal interface material for high-power package application

Crossref DOI link: https://doi.org/10.1007/s40042-023-00881-z

Published Online: 2023-07-28

Published Print: 2023-09

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Choi, Mikyeong

Jung, Seung-Boo
License Information

Text and Data Mining valid from 2023-07-28

Version of Record valid from 2023-07-28
More Information

Article History

Received: 29 March 2023

Revised: 7 June 2023

Accepted: 20 July 2023

First Online: 28 July 2023