Annealing temperature effect on the properties of untreated and treated copper films with oxygen plasma
Crossref DOI link: https://doi.org/10.1007/s40094-014-0132-x
Published Online: 2014-06-11
Published Print: 2014-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hojabri, Alireza
Hajakbari, Fatemeh
Soltanpoor, Nasrin
Hedayati, Maryam Sadat
License valid from 2014-06-11