Low temperature joining of copper by Ag nanopaste: correlation of mechanical properties and process parameters
Crossref DOI link: https://doi.org/10.1007/s40194-016-0381-1
Published Online: 2016-10-04
Published Print: 2016-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hausner, S.
Weis, S.
Wielage, B.
Wagner, G.
License valid from 2016-10-04