Study of intermetallic compounds (IMC) that form between indium-enriched SAC solder alloys and copper substrate
Crossref DOI link: https://doi.org/10.1007/s40194-017-0445-x
Published Online: 2017-03-07
Published Print: 2017-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Rodrigues, Felipe
Watson, Jonathan
Liu, Stephen
Madeni, Juan C.
Funding for this research was provided by:
Center for Welding, Joining and Coatings Research
License valid from 2017-03-07