Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder
Crossref DOI link: https://doi.org/10.1007/s40194-017-0538-6
Published Online: 2017-12-19
Published Print: 2018-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Koleňák, Roman
Hodúlová, Erika
License valid from 2017-12-19