Effect of substrates on the formation of Kirkendall voids in Sn/Cu joints
Crossref DOI link: https://doi.org/10.1007/s40194-019-00704-5
Published Online: 2019-02-26
Published Print: 2019-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Jieshi
Yang, Jin
Zhang, Yongzhi
Yu, Zhishui
Zhang, Peilei
Funding for this research was provided by:
Young Scientists Fund (51805316, 51605276)
Text and Data Mining valid from 2019-02-26
Article History
Received: 5 September 2018
Accepted: 18 January 2019
First Online: 26 February 2019