Microstructure and properties of a novel SnSbAgNi solder
Crossref DOI link: https://doi.org/10.1007/s40194-022-01453-8
Published Online: 2022-12-30
Published Print: 2023-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yuan, Linlin
Shi, Xiumei
Zhang, Guoqing
Liu, Xu
Huang, Xiaomeng
Qi, Yuefeng
Text and Data Mining valid from 2022-12-30
Version of Record valid from 2022-12-30
Article History
Received: 22 September 2022
Accepted: 15 December 2022
First Online: 30 December 2022
Declarations
:
: The authors declare no competing interests.