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Analysis of solder mask roughness and stencil shape influence on void formation in solder joints

Published Online: 2023-03-03

Published Print: 2023-05

Authors

Kozak, Martin https://orcid.org/0000-0001-8572-5235
Vesely, Petr

Dusek, Karel
Funding

Funding for this research was provided by:

České Vysoké Učení Technické v Praze (SGS21/159/OHK3/3T/13)

Czech Technical University in Prague
License Information

Text and Data Mining valid from 2023-03-03

Version of Record valid from 2023-03-03
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Article History

Received: 4 May 2022

Accepted: 19 February 2023

First Online: 3 March 2023

Declarations

:

: The authors declare no competing interests.

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