Microstructural evolution during low-temperature TLP bonding of WC-6Co cemented carbide to AISI 1045 steel using multi-layer of Ni/Cu/In/Cu/Ni
Crossref DOI link: https://doi.org/10.1007/s40194-024-01833-2
Published Online: 2024-09-13
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nahri, Saeid http://orcid.org/0009-0005-5399-8497
Tavangar, Reza
Text and Data Mining valid from 2024-09-13
Version of Record valid from 2024-09-13
Article History
Received: 25 July 2024
Accepted: 31 August 2024
First Online: 13 September 2024
Declarations
:
: The authors declare no competing interests.