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Microstructure evolution and growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under ultrasonic waves

Crossref DOI link: https://doi.org/10.1007/s40194-025-01926-6

Published Online: 2025-01-18

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Niu, Hongwei

Bian, Hong

Wang, Jian

Song, Xiaoguo

Zhao, Hongyun
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (52275321, 52175307, tsqn201812128)

Innovation Scientists and Technicians Troop Projects of Henan Province (204200510031)

Heilongjiang Touyan Innovation Team Program (HITTY-20190013)
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Text and Data Mining valid from 2025-01-18

Version of Record valid from 2025-01-18
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Article History

Received: 5 September 2024

Accepted: 2 January 2025

First Online: 18 January 2025

Declarations

:

: The authors declare no competing interests.

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