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Microstructure evolution and growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under ultrasonic waves

Crossref DOI link: https://doi.org/10.1007/s40194-025-01926-6

Published Online: 2025-01-18

Published Print: 2025-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Niu, Hongwei

Bian, Hong

Wang, Jian

Song, Xiaoguo

Zhao, Hongyun
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (52275321)

National Natural Science Foundation of China (52175307)

National Natural Science Foundation of China (tsqn201812128)

Innovation Scientists and Technicians Troop Projects of Henan Province (204200510031)

Heilongjiang Touyan Innovation Team Program (HITTY-20190013)
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Text and Data Mining valid from 2025-01-18

Version of Record valid from 2025-01-18
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Article History

Received: 5 September 2024

Accepted: 2 January 2025

First Online: 18 January 2025

Declarations

:

: The authors declare no competing interests.

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