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Preparation and performance study of high-temperature resistant joints using Cu@Ni@Sn transient liquid phase diffusion bonding materials

Published Online: 2025-10-27

Published Print: 2026-01

Authors

Zhang, Honghui https://orcid.org/0000-0002-9711-6119
Xu, Hongyan

Hodúlová, Erika
Funding

Funding for this research was provided by:

Henan Provincial Science and Technology Research Project (242102231025)

Nature Science Foundation of Beijing (2222083)

National Foreign Expert Program (H20240059)
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Text and Data Mining valid from 2025-10-27

Version of Record valid from 2025-10-27
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Article History

Received: 12 November 2024

Accepted: 9 October 2025

First Online: 27 October 2025

Declarations

:

: The authors declare no competing interests.

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