Effect of Bonding Temperature on the Microstructures and Strengths of C/C Composite/GH3044 Alloy Joints by Partial Transient Liquid-Phase (PTLP) Bonding with Multiple Interlayers
Crossref DOI link: https://doi.org/10.1007/s40195-014-0090-y
Published Online: 2014-07-10
Published Print: 2014-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Xin
Shi, Xiaohong
Wang, Jie
Li, Hejun
Li, Kezhi
Ren, Yancai
Text and Data Mining valid from 2014-07-10