An Easy Way to Quantify the Adhesion Energy of Nanostructured Cu/X (X = Cr, Ta, Mo, Nb, Zr) Multilayer Films Adherent to Polyimide Substrates
Crossref DOI link: https://doi.org/10.1007/s40195-016-0375-4
Published Online: 2016-02-05
Published Print: 2016-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wu, Kai
Zhang, Jin-Yu
Liu, Gang
Li, Jiao
Zhang, Guo-Jun
Sun, Jun
Text and Data Mining valid from 2016-02-01