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Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti–Cu–N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating

Crossref DOI link: https://doi.org/10.1007/s40195-017-0536-0

Published Online: 2017-02-06

Published Print: 2017-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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