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Temperature Gradient Induced Orientation Change of Bi Grains in Sn–Bi57–Ag0.7 Solder Joint

Published Online: 2022-01-06

Published Print: 2022-07

Authors

Chen, Yinbo

Gao, Zhaoqing

Liu, Zhi-Quan
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Text and Data Mining valid from 2022-01-06

Version of Record valid from 2022-01-06
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Article History

Received: 24 June 2021

Revised: 12 August 2021

Accepted: 19 August 2021

First Online: 6 January 2022

Declarations

:

: The authors state that there are no conflicts of interests to disclose.

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