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Solid–liquid Interdiffusion Bonding of Cu/Sn/Ni Micro-joints with the Assistance of Temperature Gradient

Published Online: 2022-06-01

Published Print: 2022-11

Authors

Lai, Yanqing

Chen, Shi

Ren, Xiaolei

Qiao, Yuanyuan

Zhao, Ning
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Text and Data Mining valid from 2022-06-01

Version of Record valid from 2022-06-01
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Article History

Received: 13 March 2022

Revised: 6 April 2022

Accepted: 13 April 2022

First Online: 1 June 2022

Declarations

:

: The authors state that there are no conflicts of interest to disclose.

Document is current