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Effect of Multiple Thermal Cycles on Microstructure and Mechanical Properties of Cu Modified Ti64 Thin Wall Fabricated by Wire-Arc Directed Energy Deposition

Crossref DOI link: https://doi.org/10.1007/s40195-024-01756-3

Published Online: 2024-08-14

Published Print: 2024-11

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Lin, Zidong

Zhao, Xuefeng

Ya, Wei

Li, Yan

Sun, Zhen

Han, Shiwei

Peng, Xiaoyang

Yu, Xinghua
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Text and Data Mining valid from 2024-08-14

Version of Record valid from 2024-08-14
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Article History

Received: 27 February 2024

Revised: 12 April 2024

Accepted: 28 April 2024

First Online: 14 August 2024

Declarations

:

: The authors state that there are no conflicts of interest to disclose.

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