Microstructures and properties evolution of Al-Zn-Mg-Cu alloy under electrical pulse assisted creep aging
Crossref DOI link: https://doi.org/10.1007/s40436-022-00404-2
Published Online: 2022-08-03
Published Print: 2022-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bian, Tian-Jun
Li, Heng
Lei, Chao
Wu, Chang-Hui
Zhang, Li-Wen
Text and Data Mining valid from 2022-08-03
Version of Record valid from 2022-08-03
Article History
Received: 28 December 2021
Revised: 23 February 2022
Accepted: 24 May 2022
First Online: 3 August 2022