Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method
Crossref DOI link: https://doi.org/10.1007/s40544-017-0142-1
Published Online: 2017-03-07
Published Print: 2017-03
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhu, Aibin
He, Dayong
He, Shengli
Luo, Wencheng
License valid from 2017-03-01