The influence of abrasive size on high-pressure chemical mechanical polishing of sapphire wafer
Crossref DOI link: https://doi.org/10.1007/s40684-015-0020-0
Published Online: 2015-04-12
Published Print: 2015-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Chuljin
Kim, Hyoungjae
Lee, Sangjik
Jeong, Haedo
Text and Data Mining valid from 2015-04-01