Effect of platen shape on evolution of total thickness variation in single-sided lapping of sapphire wafer
Crossref DOI link: https://doi.org/10.1007/s40684-016-0029-z
Published Online: 2016-07-10
Published Print: 2016-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Taekyung
Jeong, Haedo
Kim, Hyoungjae
Lee, Sangjik
Kim, Doyeon
License valid from 2016-07-01