Crossmark

ICPECVD-Dielectric Thin-Films CMOS-Compatible: Trends in Eco-Friendly Deposition

Crossref DOI link: https://doi.org/10.1007/s40684-021-00381-0

Published Online: 2021-08-02

Published Print: 2022-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Herth, Etienne https://orcid.org/0000-0002-8321-5060
Rauch, Jean-Yves
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Text and Data Mining valid from 2021-08-02

Version of Record valid from 2021-08-02
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Article History

Received: 28 January 2021

Revised: 14 June 2021

Accepted: 16 July 2021

First Online: 2 August 2021