Development of a Real-time Measurement Device for Monitoring the Internal Stress During Electroplating
Crossref DOI link: https://doi.org/10.1007/s40799-016-0155-0
Published Online: 2016-09-30
Published Print: 2017-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hong, J.-G.
Lee, C.-Y. http://orcid.org/0000-0002-5001-3542
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (MOST 103 - 2221 - E - 027 – 019)
License valid from 2016-09-30