A Review of TiNiPdCu Alloy System for High Temperature Shape Memory Applications
Crossref DOI link: https://doi.org/10.1007/s40830-015-0019-y
Published Online: 2015-06-17
Published Print: 2015-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Khan, M. Imran
Kim, Hee Young
Miyazaki, Shuichi
Text and Data Mining valid from 2015-06-01