Thermal induced single grain boundary break junction for suspended nanogap electrodes
Crossref DOI link: https://doi.org/10.1007/s40843-015-0092-8
Published Online: 2015-10-21
Published Print: 2015-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Cui, Ajuan
Liu, Zhe
Dong, Huanli
Wang, Yujin
Zhen, Yonggang
Li, Wuxia
Li, Junjie
Gu, Changzhi
Hu, Wenping
Text and Data Mining valid from 2015-10-01