Copper chalcogenide thermoelectric materials
Crossref DOI link: https://doi.org/10.1007/s40843-018-9314-5
Published Online: 2018-08-10
Published Print: 2019-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wei, Tian-Ran
Qin, Yuting
Deng, Tingting
Song, Qingfeng
Jiang, Binbin
Liu, Ruiheng
Qiu, Pengfei
Shi, Xun
Chen, Lidong
Text and Data Mining valid from 2018-08-10
Article History
Received: 17 May 2018
Accepted: 20 June 2018
First Online: 10 August 2018