Enhanced thermoelectric properties and electrical stability for Cu1.8S-based alloys: Entropy engineering and Cu vacancy engineering
Crossref DOI link: https://doi.org/10.1007/s40843-022-2306-4
Published Online: 2023-01-09
Published Print: 2023-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhou, Wei
Li, Hezhang
Shan, Zhihang
Zhang, Rui
Lu, Shikuo
Pei, Jun
Ge, Zhenhua
Zhou, Min
Wang, Yuanbing
Zhang, Boping
Text and Data Mining valid from 2023-01-09
Version of Record valid from 2023-01-09
Article History
Received: 24 September 2022
Accepted: 1 November 2022
First Online: 9 January 2023