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Interface engineering of Cu/Cu2O nanowires on Cu foam: boosting C–H bond cleavage and suppressing OH− adsorption for efficient formaldehyde electrooxidation

Crossref DOI link: https://doi.org/10.1007/s40843-025-3880-8

Published Online: 2026-01-15

Published Print: 2026-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Lv, Weixin

Pan, Linlin

Zhang, Xu

Wang, Chongchong

Wei, Meijie

Zhang, Rui

Wang, Wei

Wang, Lei
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Text and Data Mining valid from 2026-01-15

Version of Record valid from 2026-01-15
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Article History

Received: 9 October 2025

Accepted: 2 December 2025

First Online: 15 January 2026

Ethics

: Conflict of interest The authors declare that they have no conflict of interest.

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