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Wafer-scale PBF-LB/M additive manufacturing of SnAg3 as thermal interface materials for advanced high-power electronics cooling

Crossref DOI link: https://doi.org/10.1007/s40964-026-01528-8

Published Online: 2026-02-12

Published Print: 2026-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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