Microstructure and thermal expansion of copper-based amorphous alloys during structural relaxation
Crossref DOI link: https://doi.org/10.1007/s41230-020-9099-1
Published Online: 2020-02-20
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhao, Jin-bei
Fan, Xin-hui
Li, Bing
Yang, Ke
Kong, Yi-long
Wang, Zhao
Text and Data Mining valid from 2020-01-01
Version of Record valid from 2020-01-01
Article History
Received: 21 August 2019
Accepted: 30 November 2019
First Online: 20 February 2020